发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of forming an MOS transistor and a bipolar transistor capable of achieving a high hFE with a small variation on the same semiconductor substrate, and a semiconductor device.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: forming a base region 4, an emitter region 5, and a collector region 3 in a bipolar region 1 of a silicon substrate 10; forming a gate electrode 20b, a source region 6, and a drain region 7 in an MOS region 2 of the silicon substrate 10; forming a metal silicide film 50b partly covering the emitter region 5; forming an interlayer insulating film 60 on the silicon substrate 10 on which metal silicide films 50a and 50b are formed; forming a contact hole 61b penetrating the interlayer insulating film 60 directly above the portion covered by the metal silicide film 50b in the emitter region 5; and forming a metal wiring 71b in the contact hole 61b.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016157730(A) |
申请公布日期 |
2016.09.01 |
申请号 |
JP20150032930 |
申请日期 |
2015.02.23 |
申请人 |
ASAHI KASEI ELECTRONICS CO LTD |
发明人 |
GUNJI TOMOHIRO;TSUSHIMA YUKI |
分类号 |
H01L21/8249;H01L21/28;H01L21/331;H01L21/768;H01L21/8222;H01L21/8248;H01L27/06;H01L29/417;H01L29/732 |
主分类号 |
H01L21/8249 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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