SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE HAVING THE SAME

摘要

A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.

主权项

1. A semiconductor package structure, comprising:
a substrate comprising:
an insulating layer having a top surface and a side surface;a conductive circuit layer recessed from the top surface of the insulating layer, wherein the conductive circuit layer comprises at least one pad, and a side surface of the pad extends along the side surface of the insulating layer; anda conductive bump disposed on the pad, wherein a side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space; a semiconductor chip; and a solder material electrically connecting the conductive bump and the semiconductor chip, wherein a portion of the solder material is disposed in the accommodating space.