| 发明名称 |
Die Bonder and Methods of Using the Same |
| 摘要 |
A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film. |
| 申请公布号 |
US2016190088(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514686142 |
申请日期 |
2015.04.14 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Chen Shing-Chao;Liu Chung-Shi;Cheng Ming-Da |
| 分类号 |
H01L23/00;B32B38/18;B32B37/00;B32B37/06;H01L21/67;H05K13/04 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer; and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film. |
| 地址 |
Hsin-Chu TW |
