INTEGRATED CIRCUIT BONDING WITH INTERPOSER DIE

摘要

A method of bonding components is disclosed. One embodiment of such a method includes applying both heat and pressure to a stack of components that includes an interposer with a reduced degree of warpage. Reducing the distance between the interposer and a first component of the stack of the components until a spacer prevents further reduction of that space. Then, cooling the stack of components while the pressure is maintained such that the degree of warpage of the interposer remains reduced.

主权项

1. A method of bonding components, the method comprising:
placing an interposer having solder balls mounted thereto in a first jig, the first jig having a plurality of slots, the plurality of slots being configured to receive at least one of the solder balls; applying force to the interposer using the first jig such that an initial degree of warpage in the interposer is decreased; then mounting a device on the interposer, thereby forming a stack; transferring the stack from the first jig to a first chamber, wherein the first chamber comprises a bracket for receiving the solder balls of the interposer; and applying heat and pressure to the stack, thereby bonding the device to the interposer.