| 发明名称 |
SURFACE TREATMENT METHOD AND SURFACE TREATMENT DEVICE |
| 摘要 |
A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate. |
| 申请公布号 |
US2016160378(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201514955791 |
申请日期 |
2015.12.01 |
| 申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
SATO Yuki;HIRAOKA Motoki;YANAGIMOTO Hiroshi |
| 分类号 |
C25F3/14;C25D5/02;C25D17/00;C25F7/00 |
主分类号 |
C25F3/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface treatment method comprising
roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of the masking plate through the through hole, in a state where a first surface of the solid electrolyte film is arranged directly on the surface of the substrate, and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate. |
| 地址 |
Toyota-shi JP |
