发明名称 CIRCUIT BOARD AND METHOD FOR MANUFACTURE THEREOF, AND DISPLAY DEVICE
摘要 Provided are a circuit board and a method for manufacturing same, and a display device. The circuit board comprises: a base substrate (31), a circuit module, and a solder pad (32); the circuit module and solder pad are arranged on the base substrate, and the circuit module is connected to the solder pad. A base substrate is employed in place of the PCB of the prior art; the material of the base substrate of the circuit board may be the same as the material of the base substrate of the display panel, thus the circuit board and the display panel may be produced by the same manufacturer and the production cycle of the product can be reduced; furthermore, the thickness of the base substrate is less than the thickness of the PCB, thus the thickness of the display device is reduced; in contrast to the prior art, in which different circuit modules must be arranged on different PCBs, all circuit modules are arranged on the same base substrate; thus the space occupied by the circuit modules is reduced, integration is improved, circuit impedance is reduced, path length is reduced, and circuit module operating speed is increased.
申请公布号 WO2016107094(A1) 申请公布日期 2016.07.07
申请号 WO2015CN81530 申请日期 2015.06.16
申请人 BOE TECHNOLOGY GROUP CO., LTD. 发明人 MAO, DEFENG;WU, YANBING
分类号 H05K1/18;H05K1/03 主分类号 H05K1/18
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