发明名称 APPARATUS FOR PROCESSING SUBSTRATE WITH PLASMA
摘要 A plasma processing apparatus is provided to protect an electrode from plasma by fixing properly vertical and horizontal shielding members to the electrode using a fixing member. A plasma processing apparatus includes upper and lower electrodes, a plurality of vertical and horizontal shielding members, and a fixing member. The upper and the lower electrodes are spaced apart from each other in a chamber. The plurality of vertical and horizontal shielding members(132,134) enclose partially at least one out of the upper and the lower electrodes to protect the electrode from plasma. The fixing member(140) is used for pressurizing the vertical shielding member toward the electrode and fixing indirectly the vertical shielding member to the electrode.
申请公布号 KR100661745(B1) 申请公布日期 2006.12.20
申请号 KR20050067328 申请日期 2005.07.25
申请人 ADP ENGINEERING CO., LTD. 发明人 LEE, YOUNG JONG;CHOI, JUN YOUNG;SON, HYOUNG KYU
分类号 H01L21/3065 主分类号 H01L21/3065
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