发明名称 回路基板、回路基板の製造方法、電子装置及びガラスクロス
摘要 PROBLEM TO BE SOLVED: To provide a circuit board using a glass cloth and having excellent signal propagation characteristics while suppressing the cost.SOLUTION: A circuit board 1 includes a resin layer 20, a glass cloth 10 provided in the resin layer 20, and wiring 30 provided in the resin layer 20 along the glass cloth 10. The glass cloth 10 has such a structure that opened glass fiber threads 11a and glass fiber threads 11b having a dielectric constant lower than that of the glass fiber threads 11a are woven while intersecting. Consequently, the circuit board 1 in which the effects of the glass cloth 10 on a signal propagating through the wiring 30 can be minimized is obtained while suppressing the cost.
申请公布号 JP6031943(B2) 申请公布日期 2016.11.24
申请号 JP20120238184 申请日期 2012.10.29
申请人 富士通株式会社 发明人 岩井 俊樹;長岡 秀明;水谷 大輔
分类号 H05K1/03;D03D15/12;H05K1/02 主分类号 H05K1/03
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