| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive having improved workability, electrical conductivity and heat conductivity, and adhesive force to be kept unchanged when highly filled with conductive filler. SOLUTION: The conductive adhesive contains an epoxy resin, curing agent, curing accelerator, silane coupling agent, and the conductive filler. The epoxy resin contains 10-90 mass% liquid epoxy resin having a viscosity of 250mPas or lower at 25°C and two-or-more-function reactive groups, in terms of the total mass of the epoxy resin. The curing agent contains liquid phenol resin having a viscosity of 10000 Pas or lower at 25°C. The content of the liquid phenol resin is 20-70 mass% in terms of the total mass of the epoxy resin and the curing agent. The conductive filler consists of (a) first scale-shaped conductive filler having D<SB>50</SB>of 5-10μm, a tap density of 4.0g/cm<SP>3</SP>or higher, and a specific area of 0.35m<SP>2</SP>/g or larger, and (b) second conductive filler having D<SB>50</SB>of 1-5μm, a specific area of 0.6m<SP>2</SP>/g or larger, and D<SB>90</SB>/D<SB>10</SB>of 8 or more as size distribution. The mixture ratio of (b)/(a) is 0.1-1, and the content of the whole conductive filler is 85-95 mass% based on the total mass. COPYRIGHT: (C)2009,JPO&INPIT
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