| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where increase of the number of terminals for testing a memory unit can be suppressed in the semiconductor device composed by integrating a plurality of chips containing at least a memory chip and a logic chip for controlling the memory chip into one package. SOLUTION: In the case of carrying out a unit test of the memory chip 2, a test program which is written in programming language for an LSI tester for testing the memory chip 2 by a unit is converted to machine language executable by a CPU 4. The machine language data is read through an external bus IF5 and carried out by the CPU 4 to generate a test pattern to the memory chip 2 through a memory IF 6, and the CPU 4 carries out the unit test of the memory chip 2. COPYRIGHT: (C)2006,JPO&NCIPI
|
