| 摘要 |
A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.
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