ADHESION LAYER FORMING METHOD, ADHESION LAYER FORMING SYSTEM AND RECORDING MEDIUM

摘要

An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2. The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.

主权项

1. An adhesion layer forming method of forming an adhesion layer, for forming an electroless plating layer, on a substrate, comprising:
preparing the substrate; and supplying a coupling agent onto the substrate while rotating the substrate, wherein, in the supplying of the coupling agent, the coupling agent diluted with an organic solvent having hydrophilicity is supplied while maintaining the substrate in a wet state.