| 摘要 |
PROBLEM TO BE SOLVED: To provide an Sn-Sb based high temperature solder alloy having excellent wettability and also having excellent mechanical properties (particularly, in ductility, and having a reduced aging change at high temperature), and in which an interfacial reaction layer grows slowly, and the reliability in the joint is excellent. SOLUTION: The solder alloy has a composition comprising, by mass, 3.0 to 10.0% Sb, 0.01 to 1.0% Ni and 0.01 to 1.0% Ge, and the balance Sn with inevitable impurities. Alternatively, the solder alloy has a composition comprising 3.0 to 10.0% Sb,≤1.0% (not including zero as the lower limit value in the range) Cu, 0.01 to 1.0% Ni and 0.01 to 1.0% Ge, and the balance Sn with inevitable impurities. COPYRIGHT: (C)2008,JPO&INPIT
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