FILLING METHOD AND FILLING APPARATUS

摘要

This filling method comprises: a step for reducing the pressure within a processing chamber (11); a step for bringing a filling material (3) into contact with the surface of a wafer (1); a step for filling fine spaces (2) of the wafer with the filling material by means of differential pressure by applying a pressure to the entire of a surface (3a) of the filling material, said surface being on the reverse side of the wafer-side surface; and a step for firing the filling material in the whole wafer.