| 发明名称 | Electronic component package | ||
| 摘要 | Provided is an electronic component package that does not lower reliability while enabling miniaturization and high performance of the electronic component package. The electronic component package includes a main substrate, a first electronic component provided on a main surface of the main substrate, a frame body disposed so as to face the main surface of the main substrate, and a first connection terminal and a second connection terminal disposed on the main surface of the main substrate along a first side of the frame body. The second connection terminal is disposed on the first side of the frame body at a position facing a vicinity of a midpoint of a side of the first electronic component, and the second connection terminal has an area larger than an area of the first connection terminal. | ||
| 申请公布号 | US9474179(B2) | 申请公布日期 | 2016.10.18 |
| 申请号 | US201514821680 | 申请日期 | 2015.08.07 |
| 申请人 | PANASONIC CORPORATION | 发明人 | Ota Yukitoshi;Itou Fumito;Hagihara Kiyomi |
| 分类号 | H05K5/02;H05K5/00;H01L23/13;H01L23/498;H01L23/538;H05K1/14;H05K1/18 | 主分类号 | H05K5/02 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. An electronic component package comprising: a main substrate; a first electronic component provided on a main surface of the main substrate; a frame body disposed so as to face the main surface of the main substrate; and a first connection terminal and a second connection terminal, each of which is disposed on the main surface of the main substrate along a first side of the frame body, wherein the second connection terminal is disposed on the first side of the frame body at a position facing a vicinity of a midpoint of a side of the first electronic component, and the second connection terminal has an area larger than an area of the first connection terminal. | ||
| 地址 | Osaka JP | ||