| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package capable of minimizing reduction in yield of an electronic component and a method of efficiently manufacturing the same.SOLUTION: The fan-out semiconductor package includes: a frame 110 having a through-hole 110X; an electronic component disposed at the through-hole of the frame; and re-wiring parts 140 and 150 disposed on one side of the frame and the electronic component. Inside the frame, one or more first wiring layers 112, electrically coupled with the electronic component through the re-wiring parts, are disposed.SELECTED DRAWING: Figure 3 |
