| 摘要 |
PROBLEM TO BE SOLVED: To surely achieve miniaturization of an electronic device and effective use of a space while strongly joining an electronic component to a substrate end surface.SOLUTION: An electronic component mounting method comprises the steps of: making an electronic component side wiring connection part 131s of an electronic component 130 face an outer peripheral end surface 110s of a liquid crystal panel 110 having a first substrate 111 and a second substrate 112 facing each other, and a substrate side wiring connection part 113s provided between the first substrate 111 and the second substrate 112; and interposing solder 210 for glass including zinc (Zn) between the outer peripheral end surface 110s of the liquid crystal panel 110 and the electronic component side wiring connection part 131s of the electronic component 130, and forming a solder pad 200 between the substrate side wiring connection part 113s and the electronic component side wiring connection part 131s by heating the solder 210 for glass and applying ultrasonic vibration to the solder 210 for glass by an ultrasonic soldering iron.SELECTED DRAWING: Figure 1 |
