RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT USING SAME, AND SEMICONDUCTOR DEVICE

摘要

Through a resin composition characterized by including (A1) an alkali-soluble resin having specific structural units, (A2) one or more types of resins selected from the group consisting of polyimide, polybenzoxazole, polyamide-imide and precursors and copolymers thereof, and (B) a photosensitizer, the content of the (A2) resin being 310-200 parts by weight with respect to 100 parts by weight of the (A1) resin, a resin composition is provided which can be applied as a photoresist in which a high-resolution pattern shape is be maintained even after high-temperature processing, and the photoresist can be peeled after processing.