| 摘要 |
1406207 Making lead frames MATSUSHITA ELECTRONICS CORP 11 Feb 1974 [16 Feb 1973] 06145/74 Heading B3A [Also in Division H1] A metallic lead frame for a semiconductor is made by plating a strip 10 of precious metal, e.g. gold on a metallic plate and punching out the frame from the plate such that the tips of leads 2, 3, 4 are positioned on the strip 10. The metallic plate may be plated with nickel or cobalt before plating the precious strip 10, which may be positioned in the middle of, as shown, or at the side edge of the plate. After a frame having sets of leads, 2, 3, 4 has been punched out, transistor bodies are mounted on the leads 3 and electrodes of the transistors are connected to the leads 2, 4. The transistors are encapsulated with plastics whereupon each set of leads 2, 3, 4 is separated from the remainder of the frame. |
