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发明名称
SEMICONDUCTOR CHIP PACKAGING METHOD
摘要
申请公布号
JPS5382266(A)
申请公布日期
1978.07.20
申请号
JP19760158546
申请日期
1976.12.28
申请人
SUWA SEIKOSHA KK
发明人
ABE TAKASHI
分类号
H01L21/677;H01L21/48
主分类号
H01L21/677
代理机构
代理人
主权项
地址
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