发明名称 Photoelectric composite wiring module
摘要 A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.
申请公布号 US9477038(B2) 申请公布日期 2016.10.25
申请号 US201313763782 申请日期 2013.02.11
申请人 Hitachi Metals, Ltd. 发明人 Yu Juhyun;Yasuda Hiroki;Hirano Kouki;Ishikawa Hiroshi
分类号 G02B6/12;G02B6/42;G02B6/43;G02B6/44;H05K1/11 主分类号 G02B6/12
代理机构 Roberts Mlotkowski Safran Cole & Calderon, PC 代理人 Roberts Mlotkowski Safran Cole & Calderon, PC
主权项 1. A photoelectric composite wiring module, comprising: a flexible first substrate comprising a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof; a second substrate comprising a recessed portion formed on a surface of a mounting side to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate; and an optical device mounted directly on the surface of the mounting side of the second substrate and optically coupled to the optical fiber, wherein the recessed portion comprises an opening on the surface of the mounting side of the second substrate to mount the optical device, and wherein the first flexible substrate has a larger width than the second substrate along a direction transverse to the longitudinal direction of the conductive line and optical fiber, wherein the second substrate comprises a base formed of an insulating resin and having the recessed portions formed thereon and wiring patterns provided on a first principal surface of the base on the mounting side and on a second principal surface opposite to the first principal surface, and wherein the conductive line comprises a plurality of conductive lines, and wherein at least one of the plurality of the conductive lines is received in the recessed portion penetrating the base from the first principal surface to the second principal surface and is electrically connected to the wiring pattern on the second principal surface side.
地址 Tokyo JP