发明名称 METHOD AND DEVICE FOR PEELING
摘要 PURPOSE:To improve the life of a peeling die, by supplying lubricating cooling fluid to reach the peeling die together with a wire rod while injecting the lubricating cooling fluid to be supplied also from a rear surface of the peeling die. CONSTITUTION:A nozzle 11 is arranged in the front surface of a peeling die 1, and the nozzle 11 is equipped with a hole 13, guiding a wire rod 12, and through holes 14, 15, respectively for supplying lubricating cooling fluid and reverse flow preventing compressed gas to be guided, in said hole 13. While a chip guide 21, which moves cutting chips in a direction reverse to the advancing direction of the wire rod 12, is provided, and the cutting chip, moved by said chip guide 21, is finely cut by a rotary tool and collected through a collecting hole. Further the peeling die provides a lubricating cooling fluid injection mechanism to be arranged in the rear surface, and the lubricating cooling fluid is directly injected to an edge point part of the peeling die. As a result, a life of the peeling die is exceptionally improved.
申请公布号 JPS62102916(A) 申请公布日期 1987.05.13
申请号 JP19850245013 申请日期 1985.10.30
申请人 SUMITOMO METAL IND LTD;MIYAZAKI TEKKO KK 发明人 NAGAI HIROSHI;TAMAI SADAAKI
分类号 B23D79/12 主分类号 B23D79/12
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