发明名称 Method of mounting circuit on substrate and circuit substrate for use in the method
摘要 There is provided with a method of mounting a circuit on a substrate which utilizes advantages of the COG method, can enhance the yield and can reduce the cost, and a circuit substrate for use in the method. A circuit pattern, including a pectinate connecting electrode having the same pitch interval as that of a pectinate marginal electrode on an electrode pattern formed on a substrate, is formed on a stick circuit substrate having the same coefficient of thermal expansion as that of the substrate and extending in the lateral or longitudinal direction of the margin of the substrate. After the necessary number of circuits are directly mounted on the circuit substrate, the pectinate marginal electrode of the substrate and the corresponding pectinate electrode of the circuit substrate are electrically connected.
申请公布号 US5084961(A) 申请公布日期 1992.02.04
申请号 US19910669910 申请日期 1991.03.15
申请人 MICRO GIJUTSU KENKYUJYO CO., LTD. 发明人 YOSHIKAWA, MINORU
分类号 G02F1/1345;G09F9/00;H01L21/60;H05K1/03;H05K1/14;H05K3/24;H05K3/32;H05K3/36 主分类号 G02F1/1345
代理机构 代理人
主权项
地址