摘要 |
<p>A fiber sheet impregnated with a resin composition mainly comprising poly-p-phenylene sulfide and having the degree of orientation of 0.3 to 0.9. The sheet is markedly improved in thermal resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when folded, thus being suited for use as insulation base material for circuit boards and multilayer interconnection boards wherein higher-density and thinner circuits are necessitated.</p> |