| 摘要 |
<p>PURPOSE:To effectively prevent the surface of a wafer from being contaminated by charged particles when a semiconductor wafer is aligned with a prescribed position by an air gauge wherein a pneumatic sensor is used. CONSTITUTION:A semiconductor manufacturing device is equipped with a range finder mechanism which measures a distance from the nozzle 26A to the surface of the semiconductor wafer through such a manner that compressed air of a certain pressure is made to blow against the surface of a semiconductor wafer through a nozzle 26A, and the back pressure of the wafer is gauged, wherein a linear electrode 27A is provided inside an air introducing pipe which introduces compressed air to the nozzle 26A. When a distance is measured by a range finder mechanism, a prescribed voltage is applied to the linear electrode 27A to enable a corona discharge to take place for neutralizing the electric charge of charged particles in the air introducing pipe. By this setup, charged particles are effectively prevented from blowing against the surface of a semiconductor wafer together with compressed air to contaminate it.</p> |
