发明名称
摘要 PURPOSE:To easily separate and remove unnecessary substances adhering to a wafer therefrom the charging them with electrons by plasma discharge. CONSTITUTION:A wafer 1 to which dust 2 adheres is placed on an electrode 4 coated with an insulator 5. Ar is introduced into a vessel 10 and exhausted therefrom, and plasma discharge is generated between the electrode 4 and an electrode 3 by a high-frequency power source 7. Then the dust 2 is charged with electrons. Next, when negative voltage is applied to the electrode 4 by a DC power source 9, the dust 2 is separated from the wafer 1, and thus the dust, which has been hard to remove in the conventional method, can be removed with ease.
申请公布号 JPH0732147(B2) 申请公布日期 1995.04.10
申请号 JP19810111882 申请日期 1981.07.17
申请人 发明人
分类号 H01L21/302;C23C14/00;H01L21/304;H01L21/306;H01L21/3065;(IPC1-7):H01L21/304 主分类号 H01L21/302
代理机构 代理人
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