| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having high heat dissipation and capable of suppressing upsizing of a power conversion device and sufficiently reducing radiation noise, and the power conversion device.SOLUTION: A semiconductor module comprises: a conductive member 2; a first insulator 10 formed on the conductive member 2; a first electrode 8 arranged on the first insulator 10; a second electrode 9 arranged on the first insulator 10 at an interval from the first electrode 8; a semiconductor element 6 arranged on the first electrode 8 and including a positive electrode and a negative electrode; and a semiconductor element 7 arranged on the second electrode 9 and including a positive electrode and a negative electrode. The positive electrode of the semiconductor element 6 is connected to the first electrode 8, and the negative electrode of the semiconductor element 6 is connected to the positive electrode of the semiconductor element 7. The ratio of an electrostatic capacity value generated between the conductive member 1 and the negative electrode of the semiconductor element 7 to an electrostatic capacity value generated between the conductive member 2 and the positive electrode of the semiconductor element 6 is not less than 0.9 and not more than 1.1. |
