| 摘要 |
PROBLEM TO BE SOLVED: To provide a corrosion resistant copper material suitable for electrical and automobile use requiring heat resistance owing to its reduction in surface corrosion due to heat or with the lapse of time, further applicable to an electric wire and suitably used for a lead frame of semiconductor equipment, and its production. SOLUTION: The corrosion resistant copper material has a 10 to 1000Åthickness surface layer composed of a copper alloy containing 10 to 50 atomic % silicon atoms. This copper material can be obtained by subjecting a copper material, containing 0.01 to 5 atomic % silicon atoms, to annealing treatment at 100 to 600 deg.C in the presence of an atmospheric gas having >=0.5 vol.% hydrogen content to form a 10 to 1000Åthickness surface layer composed of a copper alloy containing 10 to 50 atomic % silicon atoms on the surface of the copper material. |
