发明名称 |
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE ENCAPSULATED THEREWITH |
摘要 |
In an epoxy resin composition comprising an epoxy resin, a curing agent, and 80-90 wt% of a particulate inorganic filler, fine particles having a particle size of less than 3 mu m account for 10-40 wt% of the inorganic filler, and the inorganic filler has a specific surface area of less than 2.5 m<2>/g as measured by a nitrogen adsorption BET method. The inorganic filler satisfies that when a blend of a bisphenol F type liquid epoxy resin having a viscosity of 30-45 poises at 25 DEG C as measured by Gardner-Holdt method with 75 wt% of the inorganic filler is measured for viscosity at 25 DEG C by means of an E type viscometer, the viscosity at a shear rate of 0.6 s<-1> is less than 50,000 poises and the ratio of the viscosity at a shear rate of 0.6 s<-1> to the viscosity at a share rate of 10 s<-1> is less than 2.5/1. The epoxy resin composition has a low melt viscosity enough to mold on semiconductor devices without die pad and wire deformation. |
申请公布号 |
KR100251853(B1) |
申请公布日期 |
2000.04.15 |
申请号 |
KR19970042520 |
申请日期 |
1997.08.29 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD.;MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HIGUCHI, NORIAKI;FUKUMOTO, TAKAAKI;SHIOBARA, TOSHIO;ASANO, AIITSU;TOMIYOSHI, KASTOSHI |
分类号 |
C08K3/36;H01B3/40;H01L23/29;(IPC1-7):C08L63/00 |
主分类号 |
C08K3/36 |
代理机构 |
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代理人 |
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地址 |
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