发明名称 EPOXY RESIN COMPOSITION AND RESIN SEALING-TYPE SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in rapid hardening property and fluidity, and giving a hardened product having excellent low- moisture absorbing property, adhesivity and the like by compounding an epoxy resin, a compound having plural phenolic hydroxyl groups and a cation polymerization catalyst for epoxy resins as essential components. SOLUTION: This resin composition contains, as essential components, (A) an epoxy resin (e.g. a bisphenol A-type epoxy resin), (B) a compound (e.g. bisphenol F) having phenolic hydroxyl groups of on average >=2 in a molecule and (C) a cation polymerization catalyst for epoxy resins, for example, a compound selected from ammonium salts, sulfonium salts, phosphonium salts and pyridinium salts of hexafluoroantimonic acid and hexafluorophosphoric acid. It is preferable that, in the above composition, the component B is added in such a manner that the content of the phenolic hydroxyl group becomes 0.05-0.8 mole based on 1 mole of the epoxy group in the component A, and the component C is added in an amount of 0.01-15 pts.wt. based on 100 pts.wt. of the component A.</p>
申请公布号 JP2001081156(A) 申请公布日期 2001.03.27
申请号 JP19990301479 申请日期 1999.09.17
申请人 JAPAN EPOXY RESIN KK 发明人 MURATA YASUYUKI;HAYAKAWA ATSUTO
分类号 C08G59/24;C08G59/62;C08G59/68;C08K5/00;C08K5/13;H01L23/29;H01L23/31;(IPC1-7):C08G59/24 主分类号 C08G59/24
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