| 发明名称 |
Thick film photoresists and methods for use thereof |
| 摘要 |
New methods and compositions are provided that enable application and processing of photoresist as thick coating layers, e.g. at dried layer (post soft-bake) thicknesses of in excess of 2 microns. Resists can be imaged at short wavelengths in accordance with the invention, including 248 nm.
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| 申请公布号 |
US2003027086(A1) |
申请公布日期 |
2003.02.06 |
| 申请号 |
US20020142732 |
申请日期 |
2002.05.10 |
| 申请人 |
THACKERAY JAMES W.;MORI JAMES MICHAEL;TENG GARY GANGHUI |
发明人 |
THACKERAY JAMES W.;MORI JAMES MICHAEL;TENG GARY GANGHUI |
| 分类号 |
G03F7/004;G03F7/039;G03F7/16;G03F7/26;G03F7/38;H01L21/027;(IPC1-7):G03F7/38;G03F7/40 |
主分类号 |
G03F7/004 |
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