| 摘要 |
PROBLEM TO BE SOLVED: To polish an object to be polished by holding the object to be polished in a holding member, swinging and moving the holding member in the forward and backward directions and the right and left directions by a two-axis swing mechanism, and bringing a polishing face of the object to be polished into pressure contact with a tape face of a polishing tape by a pressure contact mechanism and perform polishing machining for realizing satisfactory surface coarseness of the polishing face by forward and backward and right and left composite polishing actions because the object to be polished held in the holding member is polished by performing swinging movement in the forward and backward directions and the right and left directions. SOLUTION: A polishing device is provided with the holding member 2 capable of holding the object to be polished W, the polishing tape T capable of polishing the object to be polished held in the holding member, and the pressure contact mechanism 30 capable of bringing the polishing face of the object to be polished into pressure contact with the tape face of the polishing tape. It is further provided with the two-axis swing mechanism 3 for letting the holding member perform swinging movement in the forward and backward directions and the right and left directions. COPYRIGHT: (C)2003,JPO |
