| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel useful polymerizable imide monomer capable of forming a heat-resistant photosensitive resin cured product which is excellent in adhesion property to a substrate, photocurability and heat resistance after curing and shows little shrinkage of a coating film after thermosetting, its preparation method and a photocurable composition. <P>SOLUTION: The photocurable composition contains (A) a polymerizable imide monomer of formula (1) (wherein R is a hydrogen atom or a methyl group), (B) a photosensitive polymer and (C) a photoinitiator. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
