| 发明名称 | Methods for manufacturing an electronic module | ||
| 摘要 | A method for manufacturing an electronic module is disclosed. In an embodiment the method includes providing a passive component having an upper surface of a first area, and electrically and mechanically attaching a first semiconductor chip having a lower surface of a second area that is smaller than the first area to the passive component, wherein the lower surface of the first semiconductor chip is arranged on the upper surface of the passive component, and wherein the first semiconductor chip comprises a vertical field-effect transistor. | ||
| 申请公布号 | US9472541(B2) | 申请公布日期 | 2016.10.18 |
| 申请号 | US201514745423 | 申请日期 | 2015.06.20 |
| 申请人 | Infineon Technologies AG | 发明人 | Standing Martin;Schoiswohl Johannes |
| 分类号 | H01L25/16;H01L25/00;H01L23/32;H01L23/64 | 主分类号 | H01L25/16 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A method comprising: providing a passive component having an upper surface of a first area; and electrically and mechanically attaching a first semiconductor chip having a lower surface of a second area that is smaller than the first area to the passive component, wherein the lower surface of the first semiconductor chip is arranged on the upper surface of the passive component, and wherein the first semiconductor chip comprises a vertical field-effect transistor. | ||
| 地址 | Neubiberg DE | ||