| 摘要 |
A method of and apparatus for effecting bonding of beam lead devices such as semiconductor integrated circuit chips to microcircuit or similar plate-like elements by use of the known compliant bonding technique in which the compliant bonding medium is of tape form, e.g. aluminum tape. Such tape medium is initially unperforated and is fed stepwise to the operative position coincident with the axis of movement of a reciprocating bonding ram where a window opening of appropriate size to accommodate the device to be bonded is formed therein by displaceable punching mechanism before the actual bonding step. A multiple punch turret provides a choice of window openings of different dimensions to accommodate different size devices. The compliant medium tape may be formed with an embossed region around each window opening by using the bonding ram as a forming tool in co-operation with an embossing die on the opposite side of the tape. A selection of different bonding rams may be provided on a rotatable turret as well as a number of different embossing dies on a further turret.
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