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发明名称
PACKAGE PLATING METHOD FOR SEMICONDUCTOR ELEMENTS
摘要
申请公布号
JPS5286776(A)
申请公布日期
1977.07.19
申请号
JP19760002835
申请日期
1976.01.14
申请人
HITACHI LTD
发明人
SUGIYAMA MASAYOSHI
分类号
H01L29/74;H01L21/3205
主分类号
H01L29/74
代理机构
代理人
主权项
地址
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