Screening methodology to eliminate wire sweep in bond and assembly module packaging

摘要

Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

主权项

1. A method for quality control review of one or more electronic modules comprising:
performing a first test on a first batch of modules to detect a gross failure associated with the modules, wherein each module includes a functional assembly of electronic components, the first test comprising:
defining a first test threshold;calculating a failure rate of the first batch; andcomparing the failure rate to the first test threshold, wherein the batch is designated as fail if the calculated failure rate exceeds the first test threshold; assigning failed modules of the first test to a second batch; performing a second test on the second batch of modules to detect a wire sweep failure, wherein the second test is an electromagnetic imaging test to detect a misalignment of one or more wires in the electronic module; performing a third test on modules that pass the second test, the third test comprising an electronic current leakage screening, wherein modules that fail the second test are excluded from the third test, including establishing an electric current leakage setting for the third test, wherein the third test evaluates a module twice, wherein the current leakage setting on the module is modified for a second current leakage screen.