Process for producing planar components

摘要

In a process for producing a plurality of planar components, an insulating layer which does not yet have the desired final thickness is first produced on the principal face of the semiconductor wafer that requires the insulating layer. The insulating layer initially applied is divided up into smaller areas in such a way that no stresses occur between the material of the insulating layer and that of the common semiconductor wafer. The insulating layer is then reinforced in one or more process steps until its final thickness is achieved.