发明名称 Method of bonding crystalline silicon bodies.
摘要 <p>A method of bonding two single-crystal silicon bodies comprises the steps of: (i) mirror-polishing the contact surfaces of the bodies to reduce the surface roughness to 500A or less; (ii) removing contaminant from the mirror-polished surfaces; and (iii) bringing the surfaces into mutual contact so that substantially no foreign substance enter the gap between these surfaces.</p>
申请公布号 EP0136050(A1) 申请公布日期 1985.04.03
申请号 EP19840305653 申请日期 1984.08.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SHIMBO, MASARU C/O PATENT DIVISION;FUKUDA, KIYOSHI C/O PATENT DIVISION
分类号 C04B37/00;B23K20/24;C30B29/06;C30B33/00;C30B33/06;G01L9/00;H01L21/02;H01L21/18;H01L21/20;H01L21/304;H01L27/12;(IPC1-7):C30B33/00;G01L9/06 主分类号 C04B37/00
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