| 摘要 |
<p>A method for manufacturing an electronic device having a resin coating thereon excellent in flatness by the application of a relatively low pressure, and an apparatus therefor. Though the resin coating is pressed through a resin film, the film is so thin that the resin coating comes to be substantially directly pressed and heated on a heating roll. Since the resin coating is heated to around the softening point and crushed by the relatively low pressure, the heat efficiency of the pressing is high, speeding up the processing and improving the mass productivity. Since the resin coating is smoothed on the roll, with the film positioned at an oblique angle to the surface of the resin coating, and thereafter the film is pulled obliquely and peeled off the resin coating momentarily, it is possible to obtain a smooth resin coating with high accuracy without leaving any bubble, unevenness caused thereby, wrinkle or streak thereon. <IMAGE></p> |
