INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

摘要

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer. The IC package may also include a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between a first and second side of the first encapsulation layer. The second side may be disposed opposite to the first side. The second die may have a second plurality of die-level interconnect structures that may be electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.

主权项

1. An integrated circuit (IC) package comprising:
a first die at least partially embedded in a first encapsulation layer, the first die having a first plurality of die-level interconnect structures that are disposed at a first side of the first encapsulation layer; a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between the first side of the first encapsulation layer and a second side of the first encapsulation layer that is disposed opposite to the first side; and a second die disposed on the second side of the first encapsulation layer and at least partially embedded in a second encapsulation layer, the second die having a second plurality of die-level interconnect structures, wherein the second plurality of die-level interconnect structures are electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.