| 摘要 |
PURPOSE:To quickly form a copper wiring indicating a sufficient adhesion strength for an insulation wiring by organic conductive film, carbon film, palladium-metal-containing film. and divalent-palladium-compound-containing film for a ground conductive film and a conductive film. CONSTITUTION:An organic conductive polymer such as polypyrrole and polyaniline is used for a ground conductive film 104 which is formed on a substrate consisting of a base substrate 100, a horizontal wiring conductor 101, a vertical via conductor 102. and an insulation layer 103. In this case, the conductive polymer is applied to the substrate in the form of polymer and then film is formed by polymerization or by casting polymer liquid solution. Carbon film which is another ground conductive film can be formed by dipping the substrate into carbon black suspension liquid. Also, a ground conductive film containing palladium metal is preferable. |
