| 摘要 |
PURPOSE: To detect currents to respond to various kinds of loads on the same metal board and to make common the board. CONSTITUTION: A power semiconductor module consists of a structure wherein semiconductor chips 52, 56-61 and 62 to 67 for power are placed and fixed on the upper surface of a copper circuit 2 provided on a metal substrate via an insulating layer, the chips are enclosed in a resin case and a sealing medium is injected and cured in the interior of the resin case, and in the power semiconductor module, copper circuits respectively connected with shunts of different capacities according to their different load capacities are a plurality of parallel- connected copper circuits and projected parts 2e and 2f are respectively provided on the points of the copper circuits 2a and 2b out of more than one pair of the opposed copper circuits 2a, 2b, 2c and 2d. |
