发明名称 MOLDING FOR RESIN MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain a resin molded product good in molding efficiency and excellent in heat resistance, chemical resistance and surface appearance. SOLUTION: First, a resin composition comprising (A) 99-1wt.% of a syndiotactic styrene-based polymer and (B) 1-99wt.% of at least one kind of thermoplastic resin or elastomer having a part or the whole of the molecular chain composed of segments compatible with the noncrystalline phase portion of the component A is melted at 270-370 deg.C. Subsequently, the resultant composition is molded by using a mold covered with a thermal insulation material having <=0.01cal/cm.s. deg.C thermal conductivity at 20 deg.C and a molding cavity with its wall temperature set at 20-150 deg.C.
申请公布号 JPH0952958(A) 申请公布日期 1997.02.25
申请号 JP19950204276 申请日期 1995.08.10
申请人 ASAHI CHEM IND CO LTD 发明人 FUJIBAYASHI FUSAKI
分类号 C08J5/00;B29C45/00;B29C45/73;B29K25/00;C08L25/02;C08L71/00;(IPC1-7):C08J5/00 主分类号 C08J5/00
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