COMPOUND CUTTING DEVICE OF PRESSURE UNDER WATER LASER AND WATER JET

摘要

PROBLEM TO BE SOLVED: To provide a cutting device capable of cutting even a thick plate at a high speed under water without generating strain in the lens condensing a laser beam with a water pressure. SOLUTION: This device is provided with the laser head 2 provided under water wherein the object 1 to be cut under water is irradiated with a laser beam and molten and the water jet head 3 provided under water backward in the cut advancing direction of the laser head 2 and jetting a high pressure water to the molten part to remove the molten part. And the laser head 2 is provided with a cylindrical body part, the lens condensing the laser beam is provided in the inner part, the body part is pressed, and whereby strain is not generated in the lens under this pressure state.