| 摘要 |
<p>A plating ground film of a film which is a trimmed portion of a lower magnetic pole is first formed and then a resist frame is formed which determines the portion where the ends of the lower and upper magnetic poles are aligned and the track width. The resist frame has a tapered side surface where the lower magnetic pole is formed. Next, the lower magnetic pole is formed by plating, and an insulating gap film is formed by sputtering or CVD. Then, a plating ground film of the upper magnetic pole is formed, and the upper magnetic pole is formed by plating. Because the shapes of the upper and lower magnetic poles and the track width are determined by the resist frame forming conditions (taper angle of the side surface), the shapes do not change in the subsequent steps. The gap film may be an insulating Al2O3 film conventionally used.</p> |
