| 摘要 |
PROBLEM TO BE SOLVED: To obtain a print head holding a good adhesion between a substrate with a heating resistance element array and a heat-radiating member and good thermal conduction properties by making an adhesive material thicker than a thermal conductive non-adhesive material. SOLUTION: An aluminum heat-radiating member 1 of a breadth of approximately 380 mm is used and an alumina ceramics R substrate 4 is fixed to the center of the aluminum heat-radiating member 1. A step between an area of the heat-radiating member 1 including immediately under a heating part of the R substrate 4 and an area other than the area is approximately 0.3 mm. A gel 2 of heat-radiating properties is applied by a thickness of approximately 0.1 mm to the part immediately under the heating part. A double-sided tape 3a of a thickness of approximately 0.4 mm is set to the remaining area to fix the R substrate 4 and the heat-radiating member 1. Moreover, a PCB substrate 5 and the heat-radiating member 1 are secured by a double-sided tape of a thickness of approximately 0.1 mm. The fixed substrate is left in an over of approximately 120 deg.C for about two hours to set the-gel 2. A groove of a depth of approximately 1 mm is formed as a gel reservoir to the heat-radiating member 1 between the gel 2 and the double-sided tape 3a.
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