发明名称 EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an injection-moldable composition possessing such curing characteristics as to show heat stability not allowing curing in a cylinder and to rapidly cure in a mold by compounding an epoxy resin with a curing agent and a cure accelerator being a specified urea compound. SOLUTION: The cure accelerator used is a urea compound obtained by reacting an isocyanate compound with an alicyclic amine compound. For example, the isocyanate compound is desirably phenylene diisocyanate, and the alicyclic amine is desirably pyrrolidine. The cure accelerator used is exemplified by a compound (a substituted or unsubstituted phenylene diisocyanate/substituted or unsubstituted pyrrolidine adduct) represented by the formula (wherein Y and Z, which may be the same as or different from each other, are each hydrogen, a halogen, or an alkyl: R1 to R4, which may be the same as or different from each other, are each hydrogen or an alkyl). It is desirable that 100 pts.wt. epoxy resin is compounded with 20-120 pts.wt. curing agent and 0.1-20 pts.wt. cure accelerator.
申请公布号 JP2000226436(A) 申请公布日期 2000.08.15
申请号 JP19990029752 申请日期 1999.02.08
申请人 MITSUI CHEMICALS INC 发明人 URAKAWA TOSHIYA;TOGASHI EIKI;SAKURABA TSUKASA
分类号 B29C45/00;B29K63/00;C08G59/40;(IPC1-7):C08G59/40 主分类号 B29C45/00
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