| 摘要 |
PROBLEM TO BE SOLVED: To provide a spacer of a heat conductive electronic part having higher flexibility. SOLUTION: A heat conductive spacer includes a heat conductive filler in the resin. As the heat conductive filler explained above, the boric acid salt powder of magnesium and/or calcium covered with hexagonal boron nitride in the 25 to 50 volume % and the BN powder having the flatness of 10 or more in the 5 to 25 volume % are included in the resin. |
