| 摘要 |
PROBLEM TO BE SOLVED: To reduce the occurrence of tombstone effect at mounting of small electronic components, such as chip components. SOLUTION: A surface-mounted chip component 1, where a prescribed circuit is formed and a part terminal 1a is arranged at a rear face 1b, a mounted substrate 2 which supports the chip component 1, on which a substrate side terminal 2a which is arranged on the opposite side of the part terminal 1a is installed, and the substrate side terminal 2a is arranged on the inner side of the chip component 1 and a metal bump 3 which is arranged between the component terminal 1a of the chip component 1 and the substrate side terminal 2a of the mounted substrate 2 and which electrically connects the component terminal 1a and the substrate side terminal 2a are installed. The occurrence of tombstone effect at mounting of the chip component on the mounted substrate 2 is reduced. |
